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| ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes - Die Dimensions and Pad Coordinates PRELIMINARY ZMD31010 RBicLiteTM Technical Notes Die Dimensions and Pad Coordinates Contents 1 2 3 RBICLITETM DIE DIMENSIONS..................................................................................................................... 2 RBICLITETM PAD COORDINATES ............................................................................................................... 3 RELATED DOCUMENTS............................................................................................................................ 4 Preliminary Tech. Notes - Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 1 of 4 (c) ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes - Die Dimensions and Pad Coordinates PRELIMINARY 1 RBicLiteTM Die Dimensions * * * * * Die size (including scribeline): 2230 m x 1681 m 3.75sqmm Core die size (without scribeline): Die thickness: 390m Scribeline (distance between two core dice on wafer): 150m Pads size: 68m x 68m 2080 m x 1531 m 3.19 sqmm Preliminary Tech. Notes - Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 2 of 4 (c) ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes - Die Dimensions and Pad Coordinates PRELIMINARY 2 RBicLiteTM Pad Coordinates All pads coordinates are for pad centers and related to the corner. Name bsink por_n vbp vdd vbn vss vssa vpp sig_pd vdd vgate X Coordinate in 106.3 1109.7 1210.0 1389.3 1568.1 107.2 198.3 356.1 1428.6 1672.3 1809.2 Y Coordinate in 85.9 85.9 85.9 77.3 85.9 1444.7 1444.7 1444.7 1444.7 1435.8 1444.7 Preliminary Tech. Notes - Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 3 of 4 (c) ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes - Die Dimensions and Pad Coordinates PRELIMINARY 3 * * * * Related Documents ZMD31010 RBicLite Datasheet ZMD31010 RBicLiteTM Development Kit Documentation ZMD31010 RBicLiteTM Errata Sheet TM ZMD31010 RBicLite Application Notes - In-Circuit Programming Boards TM For the most recent revisions of this document and the related documents, please go to www.zmd.biz . This information applies to a product under development. Its characteristics and specifications are subject to change without notice. ZMD assumes no obligation regarding future manufacture unless otherwise agreed in writing. The information furnished hereby is believed to be correct and accurate. However, ZMD shall not be liable to any customer, licensee or any other third party for any damages in connection with or arising out of the furnishing, performance or use of this technical data. No obligation or liability to any customer, licensee or any other third party shall result from ZMD's rendering of technical or other services. For further information: ZMD AG Grenzstrasse 28 01109 Dresden, Germany Phone +49 (0)351-8822-366 Fax +49 (0)351-8822-337 sales@zmd.de www.zmd.biz ZMD America, Inc. 201 Old Country Road, Suite 204 Melville, NY 11747, USA Phone +01 (631) 549-2666 Fax +01 (631) 549-2882 sales@zmda.com www.zmd.biz Preliminary Tech. Notes - Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 4 of 4 (c) ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. |
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